Advantech U.S. uses the Evaporation Printing™ process to additively manufacture embedded electronic devices and circuits with features as small as 5µm on both rigid and flexible substrates with improved device performance and yield.

Printed Electronic products include fine-line interconnects and chip carriers with trace/space below 1 mil (0.001inch = 25.4µm). Such products also include passive and active components embedded directly into the conducting line for termination resistors or embedded capacitors in close proximity to the integrated circuit die.

Interposers, chip carriers and fine line interconnects manufactured with Advantech’s additive manufacturing technology offer benefits in feature and component size, weight, signal performance, reduction of external discrete components and a reduced number of required PCB layers. Single and multi chip dies, ball grid array (BGA) chip packages and chip backplanes are prime candidates for this technology.